1934 Act Registration No. 1-15128
SECURITIES AND EXCHANGE COMMISSION
Washington, DC 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 OF
THE SECURITIES EXCHANGE ACT OF 1934
Dated August 19, 2003
For the month of July 2003
United Microelectronics Corporation
(Translation of Registrant's Name into English)
No. 3 Li Hsin Road II
Science-Based Industrial Park
Hsinchu, Taiwan, R.O.C.
(Address of Principal Executive Office)
(Indicate by check mark whether the registrant files or will file
annual reports under cover of Form 20-F or Form 40-F.)
Form 20-F [X] Form 40-F [_]
(Indicate by check mark whether the registrant by furnishing the
information contained in this form is also thereby furnishing the
information to the Commission pursuant to Rule 12g3-2(b) under the
Securities Exchange Act of 1934.)
Yes [_] No [X]
(If "Yes" is marked, indicated below the file number assigned to the
registrant in connection with Rule 12g3-2(b): Not applicable)
SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the
registrant has duly caused this report to be signed on its behalf by the
undersigned, thereunto duly authorized.
United Microelectronics Corporation
Date: 8/19/2003 By /s/ Stan Hung
--------- ------------------------------------
Stan Hung
Chief Financial Officer
Exhibit
Exhibit Description
99.1 Announcement on July 17, 2003: UMC Selected by TrendChip for
Manufacturing of Taiwan's First Turnkey ADSL Residential Solution
99.2 Announcement on July 21, 2003: To announce related materials on
disposal of MediaTek Incorporation securities
99.3 Announcement on July 21, 2003: UMCi Continues Equipment Move-in at
300mm Fab
99.4 Announcement on July 23, 2003: To announce related materials on
disposal of MediaTek Incorporation securities
99.5 Announcement on July 25, 2003: To announce related materials on
disposal of MediaTek Incorporation securities
99.6 Announcement on July 30, 2003: UMC announced its unconsolidated
operating results for the second quarter of 2003
99.7 Announcement on August 5, 2003: ZyDAS Aligns with UMC for Production
of 802.11b Compliant IC
99.8 Announcement on August 6, 2003: UMC and Infineon Announce Success
and Optimization of their Technology and Manufacturing Partnership
99.9 Announcement on August 8, 2003: July sales
99.10 Announcement on August 15, 2003: 1) the trading and pledge of UMC
common shares by directors, supervisors, executive
officers and 10% shareholders of UMC 2) the acquisition and
disposition of assets by UMC
99.11 Announcement on August 18, 2003: Correction to Foreign investment in
UMC shareholding information
Exhibit 99.1
UMC Selected by TrendChip for Manufacturing of Taiwan's First Turnkey ADSL
Residential Solution
1.Date of occurrence of the event: 2003/07/16
2.Cause of occurrence: Hsinchu, Taiwan, July 16, 2003 - TrendChip Technologies
Corporation and UMC, a world leading semiconductor foundry (NYSE: UMC), today
announced that TrendChip's WireExpress ADSL chipset, the first product in its
xDSL family, is being manufactured in volume on UMC's 0.18 micron CMOS process
technology. UMC is producing the digital portion of the SoC (system on chip)
solution, which features a network processor and a Discrete Multi-Tone (DMT)
digital signal processor (DSP). The dual-chip solution, composed of TrendChip's
TC3160 ADSL processor and Silicon Laboratories' Si3101 highly-integrated analog
front end (AFE), is designed to address the cost and performance requirements of
the ADSL customer premise equipment (CPE) market.
3.Countermeasures: none
4.Any other matters that need to be specified: none
Exhibit 99.2
To announce related materials on disposal of MediaTek Incorporation securities
1.Name of the securities: common shares of MediaTek Incorporation
2.Trading date:2003/01/16~2003/07/21
3.Trading volume, unit price, and total monetary amount of the transaction:
trading volume:1,320,000 shares; average unit price:$351.46 NTD; total amount:
$463,922,000 NTD
4.Gain (or loss) (not applicable in case of acquisition of securities):
$437,575,510 NTD
5.Relationship with the underlying company of the trade: MediaTek Incorporation,
investee company under cost method
6.Current cumulative volume, amount, and shareholding percentage of holdings of
the security being traded (including the current trade) and status of any
restriction of rights (e.g. pledges):cumulative volume: 59,386,040 shares;
amount: 1,185,312,902 NTD; percentage of holdings:12.90%; status of restriction
of rights: no
7.Current ratio of long or short term securities investment (including the
current trade) to the total assets and shareholder's equity as shown in the most
recent financial statement and the operational capital as shown in the most
recent financial statement: ratio of total assets:20.59% ; ratio of
shareholder's equity:27.91%; the operational capital as shown in the most recent
financial statement:$55,720,170 thousand NTD
8.Concrete purpose/objective of the acquisition or disposal: financing operation
9.Do the directors have any objections to the present transaction?: none
10.Any other matters that need to be specified: none
Exhibit 99.3
UMCi Continues Equipment Move-in at 300mm Fab
1.Date of occurrence of the event:2003/07/21
2.Cause of occurrence: Singapore, July 21, 2003 -- UMCi, the Singapore-based
300mm fab affiliate of world-leading semiconductor foundry UMC (NYSE: UMC),
today announced the second phase of equipment move-in for its 300mm production
facility. At its last board meeting, UMCi approved installation of
front-end-of-line (FEOL) equipment to complement the existing back-end copper
equipment. The existing equipment is already producing 300mm wafers with yields
and defect densities that rival those of UMC's other 300mm facility, Fab 12A in
Tainan, Taiwan. Cumulative investment in UMCi will reach $500 million by the end
of 2003, with capacity reaching 10,000 300mm wafers per month and investment
totaling $1.2 billion by the end of 2004. UMCi, a state-of-the-art 90-nanometer
300mm facility, will feature an advanced automation scheme and single wafer
processing approach for greatly enhanced manufacturing efficiency. It is UMC's
second 300mm fab, after the company's Fab 12A, and has just entered volume
production for customer products. Recently, UMCi reached a significant milestone
with the production of its first several back-end copper processing lots.
Significantly, the wafers demonstrated impressive good die yields, equivalent to
those being achieved currently at UMC's other 300mm facility in Taiwan. Full
installation of front-end-of-line (FEOL) equipment is expected by January of
next year.
3.Countermeasures: none
4.Any other matters that need to be specified: none
Exhibit 99.4
To announce related materials on disposal of MediaTek Incorporation securities
1.Name of the securities: common shares of MediaTek Incorporation
2.Trading date: 2003/07/22~2003/07/23
3.Trading volume, unit price, and total monetary amount of the transaction:
trading volume:980,000 shares; average unit price:$373.61 NTD; total amount:
$366,139,000 NTD
4.Gain (or loss) (not applicable in case of acquisition of securities):
$346,578,736 NTD
5.Relationship with the underlying company of the trade: MediaTek Incorporation,
investee company under cost method
6.Current cumulative volume, amount, and shareholding percentage of holdings of
the security being traded (including the current trade) and status of any
restriction of rights (e.g. pledges):cumulative volume: 58,406,040 shares;
amount: 1,165,752,638 NTD; percentage of holdings:12.68%; status of restriction
of rights: no
7.Current ratio of long or short term securities investment (including the
current trade) to the total assets and shareholder's equity as shown in the most
recent financial statement and the operational capital as shown in the most
recent financial statement: ratio of total assets:20.54%; ratio of
shareholder's equity:27.84%; the operational capital as shown in the most recent
financial statement:$55,720,170 thousand NTD
8.Concrete purpose/objective of the acquisition or disposal: financing operation
9.Do the directors have any objections to the present transaction?: none
10.Any other matters that need to be specified: none
Exhibit 99.5
To announce related materials on disposal of MediaTek Incorporation securities
1.Name of the securities: common shares of MediaTek Incorporation
2.Trading date: 2003/07/24~2003/07/25
3.Trading volume, unit price, and total monetary amount of the transaction:
trading volume:960,000 shares; average unit price:$405.48 NTD; total amount:
$389,257,000 NTD
4.Gain (or loss) (not applicable in case of acquisition of securities):
$370,095,925 NTD
5.Relationship with the underlying company of the trade: MediaTek Incorporation,
investee company under cost method
6.Current cumulative volume, amount, and shareholding percentage of holdings of
the security being traded (including the current trade) and status of any
restriction of rights (e.g. pledges):cumulative volume: 57,446,040 shares;
amount: 1,146,591,563 NTD; percentage of holdings: 12.48%; status of restriction
of rights: no
7.Current ratio of long or short term securities investment (including the
current trade) to the total assets and shareholder's equity as shown in the most
recent financial statement and the operational capital as shown in the most
recent financial statement: ratio of total assets:20.50%; ratio of shareholder's
equity:27.79%; the operational capital as shown in the most recent financial
statement:$55,720,170 thousand NTD
8.Concrete purpose/objective of the acquisition or disposal: financing operation
9.Do the directors have any objections to the present transaction?: none
10.Any other matters that need to be specified: none
Exhibit 99.6
UMC announced its unconsolidated operating results for the second quarter of
2003
1.Date of the investor/press conference: 2003/07/30
2.Location of the investor/press conference: B3 Yong Le Room, The Westin
Taipei,133 Nanking East Road, Sec. 3, Taipei
3.Financial and business related information: United Microelectronics
Corporation (NYSE: UMC; TSE: 2303) ("UMC" or "the Company") today announced its
unconsolidated operating results for the second quarter of 2003.
Quarter-over-quarter revenue increased by 21.3 % to NT$21.71 billion. Revenue
for 2Q03 was NT$21,706 million, representing a 16.8% YoY increase from NT$18580
million in 2Q02, and a 21.3% QoQ increase from NT$17,898 million in 1Q03. For
2Q03, the gross profit was NT$4,983 million, and net income was NT$2,687
million. EPS was NT$0.18. Wafer shipments were 550 thousand 8-inch equivalent
wafers (excluding UMCJ and UMCi), and utilization rate was 85%, which exceeded
previously released guidance. The blended average selling price (ASP) for the
second quarter declined 1% compared with 1Q03. The percentage of revenue from
0.18-micron and below technologies in the second quarter was 38%.
Due to new customer wins in the PC segment, we are pleased to report a more than
20% growth in revenue and a 255% increase in operating income compared with the
previous quarter. We also exited the second quarter with significant momentum in
our technology development efforts, establishing UMC as the leader in the
delivery of next-generation 90-nm technology, and making further progress in
high-yield production for customer products using 0.13-micron technology on
300-mm wafers," UMC CEO Dr. Jackson Hu said. "In the third quarter we expect
demand to slow, particularly for handset components, due to high inventory
levels caused by the recent SARS outbreak. The slowdown should be short and we
are expecting demand to quickly return to normal levels. In the second half of
the year we are expecting demand for our 0.13-micron technology to improve and
we also expect the economies of scale associated with our 300mm production
facilities to result in reduced costs." Jackson continued. "By continuously
enhancing our customer-oriented services, and pioneering manufacturing
technologies, we will strengthen our position as one of the world's most
competitive semiconductor technology companies."
4.Any other matters that need to be specified: None
Exhibit 99.7
ZyDAS Aligns with UMC for Production of 802.11b Compliant IC
1.Date of occurrence of the event:2003/08/05
2.Cause of occurrence: HSINCHU, Taiwan, August 5, 2003 - ZyDAS, a fabless IC
design house that focuses on emerging communications technologies and UMC, a
world leading semiconductor foundry (NYSE: UMC), today announced that UMC is
manufacturing ZyDAS' newly released ZD1202, an 802.11b fully compliant
single-chip medium access controller (MAC) and baseband processor (BBP), on its
0.18-micron mixed-signal process technology. The chip is designed to meet users'
high throughput, low-power and high-security requirements. "A major challenge in
today's wireless local area networks (WLANs) is how to handle the multipath
impairment of wireless communication," noted Norman Hung, president of ZyDAS
Technology. "ZyDAS has invented a multipath decoding technology that can realize
the full advantage of 802.11b's complimentary code keying (CCK) even in the
presence of severe multipath distortion. As a result of this invention, ZD1202
can enlarge the coverage area of 802.11b and work in environments where other
802.11b products would fail. Yet, the fabrication of this technology would not
be possible without the assistance of a truly supportive semiconductor foundry.
UMC has played an instrumental role in our success as it delivers leading
process technology with the design support services to ensure high yields and
first-silicon success."
John Hsuan, vice chairman of UMC, said, "The wireless market continues to be a
high-growth area. As a result, UMC is committed to helping ensure that our
customers are delivering products throughout the 802.11 market space that are
truly competitive. We are pleased to partner with ZyDAS for the success of their
ZD 1202, which underscores the positive results that UMC has seen through its
partnership strategy. We look forward to cooperating with ZyDAS for their future
wireless products."
ZyDAS's ZD1202 low-power chip consumes less than 5 ma or 16 mw in standby mode.
It can also turn off its external oscillator and use a slower crystal in standby
mode to save an additional 31 mw of oscillator power. To address the security
concerns in wireless communication, the ZD1202 has been built to meet the latest
WLAN security specifications, including Wired Equivalent Privacy (WEP), Temporal
Key Integrity Protocol (TKIP), and WiFi Protected Access (WPA). Also, the ZD1202
has an "in-house" 16.5 Mbps mode that can substitute the 11 Mbps mode of 802.11b
without sacrificing its coverage area or transmission distance. The 16.5 Mbps
mode works seamlessly with other 802.11b products and is turned on automatically
when the ZD1202 detects that it is communicating with another ZD1202.
3.Countermeasures: none
4.Any other matters that need to be specified: none
Exhibit 99.8
UMC and Infineon Announce Success and Optimization of their Technology and
Manufacturing Partnership
1.Date of occurrence of the event: 2003/08/06
2.Cause of occurrence: HSINCHU, Taiwan, and MUNICH, Germany, August 6, 2003 -
UMC (NYSE:UMC) and Infineon Technologies AG (Infineon) (NYSE:IFX), today
announced success in their 90nm development program with the delivery of
functional complex circuitry utilizing the industry's most advanced production
technology. This milestone confirms that this technology is ready to move to
production later this year. The companies also announced the success of their
300-mm joint engineering efforts with the achievement of high-yield pilot
production for a 130nm SoC IC targeted at mobile applications and incorporating
sensitive analog/mixed mode circuitry. Despite the challenges of 300-mm
production, these chips are currently being produced at UMC fabs at yield levels
that equal or surpass those attained by similar products on mainstream 200-mm
wafers.
Dr. Andreas von Zitzewitz, chief operating officer (COO) at Infineon, said
"While Infineon was one of the very first companies to demonstrate the
economical advantages of high-volume manufacturing of DRAMS on 300-mm wafers, we
have now managed to attain a similar milestone for complex SoC ICs with analog
and mixed-mode functionality, in close cooperation with our technology and
manufacturing partner UMC. We are very pleased with this joint success.
It clearly demonstrates the power of real partnerships to enhance progress in
leading-edge silicon technology production." Dr. Jackson Hu, CEO of UMC,
explained, "We are very excited about the progress that we have made working
with Infineon to achieve working 90nm silicon and to reach high-yielding
production for 0.13um SOCs on state-of-the -art 300-mm wafers. This validates
the success of UMC's partnership approach, and our ability to work closely with
key customers to develop processes that enable them to meet their
time-to-silicon and time-to-volume requirements. We intend to continue our
partnership programs based on technology developed by UMC and optimized to
achieve the goals of our many customers." Having achieved the primary objectives
of their joint development program, UMC and Infineon plan to continue their
cooperation on process development through joint engineering efforts in specific
advanced technologies needed for IFX product success.
In this context and to better meet Infineon's requirements as a foundry partner,
the companies also agreed that UMC would buy back Infineon's equity share in
UMCi Pte Ltd. UMCi is the Singapore manufacturing venture formed in April 2001
by Infineon, UMC, and Singapore's Economic Development Board
investment arm (EDBI). EDBI will retain its equity position in UMCi. This move
will allow Infineon and UMC to concentrate on their broader manufacturing
partnership, and give Infineon a more flexible manufacturing approach that
includes access to all of UMC's wafer fabs. The parties anticipate large volume
production to ramp up initially at UMC's Taiwan facilities, and later at UMCi,
as its production capacity comes on line. UMCi is currently on track with its
equipment installation as announced earlier this year.
3.Countermeasures: none
4.Any other matters that need to be specified: none
Exhibit 99.9
United Microelectronics Corporation
August 8, 2003
This is to report the changes or status of 1) Sales volume 2) Funds lent to
other parties 3) Endorsements and guarantees 4) Financial derivative
transactions for the period of July 2003
1) Sales volume (NT$ Thousand)
-----------------------------------------------------------------------------------------------------------
Period Items 2003 2002 Changes %
-----------------------------------------------------------------------------------------------------------
July Invoice amount 6,931,165 6,850,341 80,824 1.18%
-----------------------------------------------------------------------------------------------------------
Jan -Jul Invoice amount 48,272,340 40,787,367 7,484,973 18.35%
-----------------------------------------------------------------------------------------------------------
July Net sales 7,010,969 6,724,827 286,142 4.26%
-----------------------------------------------------------------------------------------------------------
Jan -Jul Net sales 46,615,121 37,464,155 9,150,966 24.43%
-----------------------------------------------------------------------------------------------------------
2) Funds lent to other parties (NT$ Thousand)
-------------------------------------------------------------------------------------------------------
Balance as of period end
-------------------------------------------------------------------------------------------------------
This Month Last Month Limit of lending
-------------------------------------------------------------------------------------------------------
UMC 0 0 30,949,691
-------------------------------------------------------------------------------------------------------
UMC's subsidiaries 30,631 30,810 1,940,958
-------------------------------------------------------------------------------------------------------
3) Endorsements and guarantees (NT$ Thousand)
-------------------------------------------------------------------------------------------------------
Change in This Month Balance as of period end Limit of endorsements
-------------------------------------------------------------------------------------------------------
UMC 0 0 61,899,383
-------------------------------------------------------------------------------------------------------
UMC's subsidiaries 0 0 0
-------------------------------------------------------------------------------------------------------
UMC endorses for subsidiaries 0 0
-------------------------------------------------------------------------------------------------------
UMC's subsidiaries endorse for UMC 0 0
-------------------------------------------------------------------------------------------------------
UMC endorses for PRC companies 0 0
-------------------------------------------------------------------------------------------------------
UMC's subsidiaries endorse for PRC companies 0 0
-------------------------------------------------------------------------------------------------------
4) Financial derivatives transactions
a-1 Hedging purpose (for assets/liabilities denominated in foreign currencies)
-------------------------------------------------------------------------------------------------------
Underlying assets / liabilities N/A
-------------------------------------------------------------------------------------------------------
Financial instruments
-------------------------------------------------------------------------------------------------------
Realized profit (loss)
-------------------------------------------------------------------------------------------------------
a-2 Hedging purpose (for the position of floating rate liabilities)
-------------------------------------------------------------------------------------------------------
Underlying assets / liabilities N/A
-------------------------------------------------------------------------------------------------------
Financial instruments
-------------------------------------------------------------------------------------------------------
Realized profit (loss)
-------------------------------------------------------------------------------------------------------
b Trading purpose : None
Exhibit 99.10
United Microelectronics Corporation
For the month of July, 2003
This is to report 1) the trading of directors, supervisors, executive officers
and 10% shareholders of United Microelectronics Corporation ("UMC") (NYSE : UMC)
2) the pledge and clear of pledge of UMC common shares by directors,
supervisors, executive officers and 10% shareholders of UMC 3) the acquisition
assets by UMC 4) the disposition of assets by UMC for the month of July, 2003
1) The trading of directors, supervisors, executive officers and 10%
shareholders
-------------------------------------------------------------------------------------------------------------------
Title Name Number of shares held Number of shares Number of shares Changes
when elected (for held as of held as of
Directors, June 30, 2003 July 31, 2003
Supervisors and
Executive Officers)
or as May 30, 2001
-------------------------------------------------------------------------------------------------------------------
CMO Chris Chi* 3,277,640 3,216,464 (189,000)
-------------------------------------------------------------------------------------------------------------------
President Fu-Tai Liou** 5,492,301 5,619,735 (90,000)
-------------------------------------------------------------------------------------------------------------------
*received 127,824 shares of stock dividend in July, 2003
**received 217,434 shares of stock dividend in July, 2003
2) The pledge and clear of pledge of UMC common shares by directors,
supervisors, executive officers and 10% shareholders :
-------------------------------------------------------------------------------------------------------------------
Title Name Number of Number of Changes
shares pledge shares pledge
as of as of
June 30, 2003 July 31, 2003
-------------------------------------------------------------------------------------------------------------------
N/a N/a
-------------------------------------------------------------------------------------------------------------------
3) The acquisition assets (NT$ Thousand)
--------------------------------------------------------------------------------------------------
Description of assets July Jan - Jul
--------------------------------------------------------------------------------------------------
Semiconductor Manufacturing Equipment 484,805 3,797,345
--------------------------------------------------------------------------------------------------
Fixed assets 41 38,475
--------------------------------------------------------------------------------------------------
4) The disposition of assets (NT$ Thousand)
--------------------------------------------------------------------------------------------------
Description of assets July Jan - Jul
--------------------------------------------------------------------------------------------------
Semiconductor Manufacturing Equipment 27,347 1,020,619
--------------------------------------------------------------------------------------------------
Fixed assets 9,240 27,523
--------------------------------------------------------------------------------------------------
Exhibit 99.11
Correction to Foreign investment in UMC shareholding information
1.Date of occurrence of the event: 2003/08/18
2.Cause of occurrence: Sinopac Securities, UMC's common stock's transfer agent
has erroneously reported such information and we are now making this correction.
3.Countermeasures: The correct information is being disclosed on Taiwan
Stock Exchange's Market Observation Post System.
4.Any other matters that need to be specified: none.